Products

Chip on Board (COB)

Chip-on-Board Devices used in consumer products and communication gadgets

Smart Card & Memory Stick

Smart Card and Memory Stick used for data storage and communication gadgets.

Optoelectronics

Optoelectronics used for application of electronics devices and that source, detect and control of light.

Receiver Modules

Receiver Modules used consumer products for wireless communication, wireless data transfer and remote controls.

Chip on Tag/RFID and FOC

RFID tags which have stored data information that can talk to a network system to track every information needed.

Reflect & Transmit Sensors/Couplers

Sensors and couplers devices used in consumer products which are designed to detect quantitative physical parameters such as position, temperature and others.

Manufacturing

Electronics and Coil Manufacturing Services

  • Captive Line with customers assembly line configuration requirements
  • Product and Process collaboration
  • Product assembly and Testing
  • Inspection and evaluation
  • New Product Development

Machine Trading

  • Buy and sell of used equipment
  • Recondition, modification of used equipment

Long-term Lease

  • Expansion purposes
  • Reduction of overhead expenses in terms of facility cost

Scanning Acoustic Microscopy (SAM) Inspection

Sonix™ Echo

The universal inspection tool for production, failure analysis and development.

Sonix™ nondestructive ultrasonic testing equipment is made to increase yield, simply testing and improving productivity and throughput of the production floor and in the lab.

New from Sonix™ only – Make set up and testing easy by using the unique interactive touch screen and joystick controls right at the tool (patent pending).

Whether the need is detailed lab analysis or production floor throughput, Sonix™ has an easy to use software solution.

  • WINIC™ Lab (Detailed Failure Analysis Tools)
  • WINIC™ Production (Easy to use streamlined productivity tool, built for throughput and volume analysis)
  • Analysis toolbox delivers automated pass/fail criteria

Features & Benefits

Sonix™ Echo™ can detect defects as small as 0.05 micron and is an excellent tool for bump detection, stacked die (3D packaging) inspection, complex flip chip inspection and more traditional plastic packages.

Other Key Features

  • Reduced footprint (saving valuable clean room space)
  • Portable (easy move)
  • Reduced tank height (for improved ergonomics)
  • Maximum 360 visibility (for ease of use)
  • 2 USB ports on front console (for ease of use and added functionality)
  • Slide out shelf (for part or fixture storage)
  • Compact and robust system design (for low maintenance)
  • Slide out electrical panel (for easy access)
  • Welded unibody frame (for improved platform stability)
  • Simultaneous pulse echo and through transmission option (quick defect detection)
  • Large scan area (for multiple trays or larger samples)
  • Transducer based Z-axis (moves transducer instead of tray fixture)
  • Will comply with European Machinery Detective
  • Conformity to CE, SEMI, S2, NRTL
  • ESD coatings on plastic safety cover, tank and doors

OKOS VUE 400-P

Semiconductor Package Failure Analysis

Voids – Disbonds – Cracks – Delamination – Internal defects

Included software modes:

  • Basic (user-friendly)
  • Advanced (detailed analysis)
  • Production (automated scanning)
  • Office analysis (virtual scanning)

Talk To Us Today!

049-502 9926

DPL recognizes customer satisfaction. That’s why DPL is committed to produce products that meet or exceed our customer requirements.